Method for manufacturing ic card by laminating a plurality of foils

ABSTRACT

The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.

FIELD OF THE INVENTION

The present invention relates to a method of manufacturing an IC card,and more particularly, to a method of manufacturing an IC card in whichtwo or more foils having corresponding holes formed therein are stackedon a chip-on-board (hereinafter, referred to as “COB”) and are thencompressed each other.

BACKGROUND OF THE INVENTION

A card on which data and programs are mounted on a COB, i.e., an IC cardhas been increasingly used in a variety of fields due to its convenienceand the ability to retain information. Such an IC card is mainlyclassified into a contact type IC card to/from which information isinputted/outputted as a terminal for a card reader and an electrode arebrought into contact with each other, a non-contact type IC card to/fromwhich information is inputted/outputted through an antenna even withoutcontacting the terminal for the card reader, and a combi type IC cardhaving both the functions of the contact and non-contact type cards.

This kind of an IC card is manufactured by stacking a plurality of foils(also referred to as “sheet”) to form a card shape, digging a groove 900having a predetermined size by means of a milling process so that a COB200 can be mounted in the groove 900, inserting the COB 200 into thegroove 900, and then covering the resulting surface with at least onecover foil, as shown in FIG. 1. This method, however, needs a process ofdigging the groove 900 for the COB 200 in a card base that is roughlyformed by stacking the plurality of the foils. Due to this, this methodhas a disadvantage that the process is dually performed. In particular,in manufacturing the combi type IC card, after the COB is inserted intothe groove with an electrode surface for a contact terminal exposedoutwardly, an antenna electrode of the COB and an antenna on which aconductive wire is wound in a given form must be electrically connected.This makes it very difficult for a worker to connect both ends of theantenna and the antenna electrode of the COB in a state where the workerdoes not see the both ends of the antenna and the antenna electrode.

In other words, in a state where the end of the antenna is exposedtoward the inside of the groove, the COB is inserted into the groovewith a molding element directed downwardly. In this case, the antennaelectrode formed in a main board of the COB must be electricallyconnected to the both ends of the antenna. At this time, as the COB islocated between the eyes of the worker and the groove, i.e., the antennaconnection element, this veils the visual field of the worker (in otherwords, the electrode to be connected to the antenna is located at therear of the main board that is not seen by the worker). For this reason,a conductive paste (or adhesive) is covered on both ends of the antennaexposed toward the inside of the groove, and the COB is inserted/thencompressed, or a hot melt sheet is adhered and the COB is inserted andthen thermally compressed.

However, the electrical connection of the antenna connection element andthe COB electrode becomes unsatisfactory through such adhesion method.In this case, if the IC card is used for a long time, there is a problemthat the electrical connection may be disconnected or the COB itself maybe separated from the card. Furthermore, in order to insert the COB intothe groove formed in the stacked foil, it is inevitable that the area ofthe groove is greater than the area of the COB in structure even alittle. Accordingly, in case of a completed IC card, a gap may existbetween the COB and the groove. This gap may cause a possibility thatmoisture is infiltrated. Further, if the card is bent, the COB may bedeviated from the card plate through the gap.

OBJECTS OF THE INVENTION

Accordingly, the present invention has been made in view of the aboveproblems, and it is an object of the present invention to provide amethod of manufacturing an IC card that can obviate the process ofdigging a groove again after foils are stacked.

Another object of the present invention is to provide a method ofmanufacturing an IC card in which a COB and foils' can be stronglycoupled.

Still another object of the present invention is to provide a method ofmanufacturing an IC card that can minimize a gap between the COB and thefoils.

Still another object of the present invention is to provide a method ofmanufacturing an IC card in which an electrode and an antenna electrodeof a COB can be strongly coupled.

Still another object of the present invention is to provide a method ofmanufacturing an IC card in which a half-finished product manufacturingprocess and a finished product manufacturing process are separated.

Still another object of the present invention is to provide a method ofmanufacturing an IC card having a high smoothness.

Still another object of the present invention is to provide a method ofmanufacturing an IC card, which can solve a problem that a hole intowhich a COB is inserted is contracted due to thermal compression in theIC card half-finished product manufacturing process.

According to a first aspect of the present invention, a method ofmanufacturing an IC card does not include the step of digging a groovefor inserting a COB into a foil after the foil is stacked. To this end,the method of manufacturing the IC card includes the step of forming ahole for inserting the COB into at least one foil, and then stacking andcompressing the COB and the foil. In the concrete, the method ofmanufacturing the IC card includes the steps of disposing the COB sothat an electrode surface for a terminal of a COB is orienteddownwardly, stacking two or more foils having a hole of a size intowhich the COB can be inserted so that the COB is inserted into the hole,stacking a foil having a hole not formed therein on the foils, and thencompressing the stacked foils.

In a second aspect of the present invention of the method ofmanufacturing the IC card, a process of electrically connecting anantenna winding formed in a foil to an electrode formed in a COB isfacilitated. Accordingly, a physical bonding strength between theantenna winding and the COB electrode becomes strong and an additionaladhesive, etc. can be easily used. This results from the process ofelectrically connecting the antenna formed in the antenna foil and theantenna electrode of the COB in a state where the antenna electrode ofthe COB is disposed upwardly. In the concrete, the COB is disposed sothat an electrode surface for a contact terminal of a COB is disposeddownwardly. At least one foil having a hole into which the main board ofthe COB can be inserted formed therein is first stacked so that the COBis inserted into the hole. Next, an antenna foil in which the antennawinding is formed and the other hole corresponding to the location ofthe hole is formed, is stacked so that the other hole is inserted intothe molding element of the COB. Both ends of the antenna winding arethen electrically connected to the antenna electrode of the COB.Thereafter, the other foil is stacked at the opposite side to the sidethat the electrode surface for the contact terminal of the COB isexposed toward the outside. The stacked foils are then compressed. Atthis time, the molding element of the COB and the antenna electrode areexposed upwardly through the hole formed in the antenna foil.

In a third aspect of the method of manufacturing the IC card, the methodis divided into a first step half-finished product process and a secondfinished product process and is compatible with a common practice ofmanufacturing the IC card. Also, in a final finished productmanufacturing process, a conventional production line (that is, aprinting equipment, an equipment for stacking and compressing printedfoils, etc.) is used intact. To this end, the method of manufacturingthe IC card includes the first step half-finished product manufacturingprocess, including the steps of forming a hole through which a moldingelement and an antenna electrode of a COB are exposed at a predeterminedlocation, inserting the wound antenna foil into the molding element ofthe COB so that both ends of the antenna are exposed toward the insideof the hole, electrically connecting the both ends of the antenna to theantenna electrode of the COB, stacking a foil having a hole not formedtherein on an opposite side to the side for a terminal of the COB thatis outwardly exposed, and compressing the stacked foils; and a secondstep finished product process, including the steps of stacking at leastone foil having a hole into which the main board of the COB can beinserted so that the foil has a thickness substantially same as athickness of the main board of the COB, and compressing the entirestacked foils.

According to a fourth aspect of a method of manufacturing an IC card, anantenna winding and an electrode of a COB have a strong bondingstrength. In other words, this method includes the step of adhering anantenna winding formed in an antenna foil and an antenna electrode ofthe COB through ultrasonic welding, application of a conductive adhesiveor adhesion using a hot melt sheet, in a state where the antennaelectrode of the COB is exposed upwardly. In a conventional method ofmanufacturing an IC card, the COB itself prevents a worker's visualfield. It is thus difficult to directly connect the antenna winding andthe antenna electrode of the COB.

According to a fifth aspect of a method of manufacturing an IC card, abonding strength between a COB and a foil stacked on the COB is doubledby a hot melt sheet. For this purpose, this method further includes thestep of adhering a hot melt sheet in which a hole to expose a moldingelement and an antenna electrode of the COB is formed on a main board ofthe COB. By including this step, the bottom of the hot melt sheet isadhered to the main board, and the top of the hot melt sheet is adheredto the foil that is subsequently stacked on the hot melt sheet throughthermal compression.

According to a sixth aspect of a method of manufacturing an IC card, amethod of manufacturing an IC card having a high smoothness is provided.For this, this method includes the steps of applying a filler between amolding element of a COB and a foil stacked on the molding element,and/or applying a filler to a portion in which an antenna winding and anantenna electrode of the COB are electrically connected.

According to a seventh aspect of a method of manufacturing an IC card,there is provided a manufacturing method of preventing a problem that ahole formed in an antennal foil can thermally shrink due to firstthermal compression in a step half-finished product manufacturingprocess. To this end, this method includes the steps of compressing alamination foil onto the antenna foil in which the antenna winding isformed to form a base foil, forming a hole into which the moldingelement of a COB is inserted in the base foil, inserting the hole of thebase foil into the molding element of the COB, electrically connectingthe antenna electrode of the COB and the antenna winding, and stackingthe foil having a hole not formed therein on the base foil and thentack-welding the foil.

BRIEF DESCRIPTION OF THE DRAWINGS

Further objects and advantages of the invention can be more fullyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings in which:

FIG. 1 is a cross-sectional view schematically shown to explain a methodof manufacturing the IC card according to a prior art;

FIG. 2(A) is a perspective view shown to explain a method ofmanufacturing an IC card according to an embodiment of the presentinvention, and FIG. 2(B) is a cross-sectional view of the IC card shownin FIG. 2(A);

FIG. 3(A) is a perspective view shown to explain a method ofmanufacturing an IC card according to another embodiment of the presentinvention, and FIG. 3(B) is a cross-sectional view of the IC card shownin FIG. 3(A);

FIG. 4(A) and FIG. 4(B) are plane views each showing a second holeformed in an antenna sheet in the method of manufacturing the IC cardaccording to an embodiment of the present invention;

FIG. 5(A) is a traverse section view (taken along lines A-A′ in FIG.2(A)) of an IC card on which a plurality of foils are stacked in a firststep half-finished product manufacturing process according to anembodiment of the present invention, and FIG. 5(B) is a longitudinalsection view (taken along lines B-B′ in FIG. 2(A)) of the IC card shownin FIG. 5(A); and

FIG. 6(A) is a traverse section view of an IC card on which a pluralityof foils are stacked in a first step half-finished product manufacturingprocess according to another embodiment of the present invention, andFIG. 6(B) is a longitudinal section view of the IC card shown in FIG.6(A).

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described in detail in connection withpreferred embodiments with reference to the accompanying drawings.

FIG. 2(A) is a perspective view shown to explain a method ofmanufacturing an IC card according to an embodiment of the presentinvention, and FIG. 2(B) is a cross-sectional view of the IC card shownin FIG. 2(A).

An IC card 100 of the present invention has a plurality of foils stackedthereon. One work plate (not shown) that is substantially flat is firstlaid on the floor. A COB 200 is then placed on the work plate. It ispreferred that the work plate is a metal plate having a predeterminedthickness. Though it will be described later, the metal plate has anadvantage that it can be easily thermally compressed onto the workplate. The COB 200 is a common COB and has a structure in which a chipof a wafer state is disposed on a main board 210 and a molding element220 is formed on the chip. The molding element 220 does not necessarilyrefer to only molding, but may refer to anything that can protect thechip, including potting. In the COB 200 for use in a contact type cardamong such a COB, the bottom of the main board 210, i.e., an oppositeside in which the molding element 220 is formed becomes an electrodesurface 211 for an external terminal. Furthermore, in the COB 200 foruse in a combi type card, two antenna electrodes 212 to be connected toan antenna wire 410 are formed on the main board 210, and the bottom ofthe main board 210 becomes the electrode surface 211 for the externalterminal in the same manner. When placing the COB 200 on the work plate,the electrode surface 211 for the terminal of the COB 200 is disposed toface the work plate. It is thus possible to see the molding element 220from the upper direction. Hereinafter, “upper direction” refers to adirection that directs from reference numeral 600 to reference numeral300 and “lower direction” refers to a direction that directs fromreference numeral 300 to reference numeral 600. Hereinafter, a method ofmanufacturing the combi type IC card will be first described.

A hot melt two-sided sheet 700, i.e., the bottom of the sheet 700 onboth ends of which an adhesive material melt and adhered by heat isformed, is adhered to portions except for the molding element 220 andthe antenna electrode 212 of the COB 200. The top of the sheet 700 isadhered to a core foil 500, which will be described later on. Anoilpaper is preferably formed on the top of the hot melt two-sided sheet700. Thus, a worker can adhere the core foil 500 to the hot melttwo-sided sheet 700 after stripping off the oilpaper. It is preferredthat the hot melt sheet 700 is not greater than the outermost edgeportion of the COB 200, i.e., the main board 210 portion. It is morepreferable that the portion adhered to the core foil 500 becomes wide bymaximum by making the outermost edge of the hot melt sheet 700substantially coincident with the outermost edge of the main board 210.

Furthermore, a sheet hole 710 or a

shaped groove is formed in the portion contacting the antenna electrode212 of the hot melt sheet 700, so that an antenna connection element 411to be described later and the antenna electrode 212 can be electricallyconnected through ultrasonic welding, adhesion using a conductiveadhesive, soldering, etc. A central hole 720 into which the moldingelement 220 is inserted (preferably, having substantially the same sizeas the molding element 220), is formed at the central portion of the hotmelt sheet 700.

If the COB 200 to which one side of the hot melt sheet 700 is adhered islocated on the work plate, a front cover foil 300 having a hole(hereinafter, referred to as “first hole” 301) of substantially the samesize as the main board 210 of the COB 200 is laid on the work plate,while the first hole 301 is being inserted into the main board 210. Atthis time, it is preferred that as the first hole 301 and the main board210, i.e., the outermost edge portion of the COB 200 are approaching bymaximum, the size of the adjacent holes is mated. The front cover foil300 functions to protect the IC card 100 according to the presentinvention from moisture, etc. and is preferably made of a transparentcoating filil In the above, the process of laying the front cover foil300 may be omitted, if necessary, which will be described later.

If the front cover foil 300 is laid on the work plate, an antenna foil400 having an antenna winding 410 formed thereon is stacked on the frontcover foil 300 (the process of forming the antenna winding is known inthe art and the shape of the antenna winding may differ from that shownin the drawing). At this time, a second hole 401 is formed in theantenna foil 400. The size of the second hole 401 is determined so thatthe molding element 220 and the antenna electrode 212 of the COB 200 canbe exposed when viewed by the worker from the upper direction. Further,the second hole 401 may have the same shape as the first hole 301. Ifthe second hole 401 has a different shape from the first hole 301, it isimportant to expose the molding element 200 and the antenna electrode212.

In the drawing, it is shown that the antenna connection element 411 isexposed toward the inside of the second hole 401 in the

shape. The present invention, however, is not limited to the aboveexample. It is important that the antenna connection element 411 isadequately protruded toward the inside of the second hole 401 so thatthe portion corresponding to the antenna end substantially correspondsto the antenna electrode 212. It is, however, to be noted that thetechnical construction related to the connection of the antennaconnection element and the antenna electrode can be easily implementedby those skilled in the art. A stacked thickness of the front cover foil300 and the antenna foil 400 is made equal to a thickness of the mainboard 210 of the COB 200. The antenna foil 400 may be stacked after theantenna 410 is formed, or the antenna 410 may be formed after a foilhaving the antenna 401 not formed therein is stacked. Though notparticularly specified in this context, it is construed that the antennafoil 400 includes both the two kinds.

If the antenna foil 400 is stacked, the oilpaper attached to the top ofthe hot melt sheet 700 is stripped off (the oilpaper may be stripped offbefore or after the front cover foil is stacked). The antenna connectionelement 411 and the antenna electrode 212 of the COB 200 are thenelectrically connected. At this time, the electrical connection may bepreferably accomplished using ultrasonic welding, soldering, aconductive adhesive and the like. The end of the antenna 410, i.e., aportion of the antenna connection element 411 that does not make contactwith the antenna electrode 212 may be adhered to the top of the top ofthe hot melt sheet 700, if appropriate.

If the antenna connection element 411 and the antenna electrode 212 ofthe COB 200 are electrically connected, a core foil 500 is stackedthereon. A third hole 501 into which the molding element 220 of the COB200 can be inserted, is formed in the core foil 500. It is preferablethat the size of the third hole 501 is substantially the same area asthe area of the molding element 220, and a thickness of the core foil500 and a thickness of the molding element 220 are made same. Thus, if astacked thickness of the front cover foil 300 and the antenna foil 400becomes same as a thickness of the main board 210 of the COB 200, thererarely exists a gap between the COB 200, the front cover foil 300, theantenna foil 400 and the core foil 500.

If the core foil 500 is stacked, a backside cover foil 600 is stacked onthe core foil 500. The backside cover foil 600 has substantially thesame function as the front cover foil 300. The backside cover foil 600is preferably made from a transparent coating film. Generally, objectsfor indicating a subject of the card, giving publicity, etc. are printedon the surface of the IC card. In case of the IC card of the presentinvention, objects are printed on the bottom of the antenna foil 400 orthe top of the core foil 500. It is preferred that the printed objectsare protected by the cover foils 300 and 600.

If the backside cover foil 600 is stacked, the other work plate(substantially flat metal plate) is laid on the backside cover foil 600.The two work plates are then compressed. In this case, the work platesare heated at constant temperature, whereby the plurality of the foilsare well compressed with one another and the top of the hot melt sheet700 is well adhered to the core foil 500. The hot melt sheet 700 servesto minimize the gap between the third hole 501 formed in the core foil500 and the first and second holes 301 and 401.

It has been described above that the IC card is formed by stacking thefront cover foil 300, the antenna foil 400, the core foil 500 and thebackside cover foil 600, in case where the IC card of the presentinvention becomes a combi type card. It is, however, to be understoodthat the front cover foil 300 or the backside cover foil 600 may beomitted, other foils may be further inserted between the foils, and avariety of foils may be stacked, if necessary. It may be necessary thatthe foils 300, 400, 500 and 600 have the property that is adhered withone another when being thermally compressed. It is, however, to be notedthat existing foils may be employed, if necessary.

A case where the IC card according to the present invention becomes acontact type card will be described. In the contact type card, the COB200 does not have the antenna electrode 212 described above. The antenna410 is thus not formed in the antenna foil 400. Furthermore, in case ofusing a hot melt sheet, the sheet hole 710 for the antenna electrode 212is not formed. Other processes are substantially the same as those forembodying the method of manufacturing the combi type IC card. In otherwords, the method of manufacturing the contact type card includes layingthe COB 200 on the work plate, laying the front cover foil 300 havingthe first hole 301 on the COB 200, and then forming the second hole 401on the front cover foil 300 but stacking the antenna foil 400 having anantenna not formed thereon. The second hole 401 must have the size intowhich the molding element 220 can be inserted, preferably substantiallythe same as the size of the first hole 301. Next, the core foil 500having the third hole 501 corresponding to the molding element 220 isstacked. The backside cover foil 600 is then stacked on the core foil500.

It has been described above that the COB 200 is placed on the workplate, and the front cover foil 300 and the antenna foil 400 are thenstacked. However, the COB 200 may be inserted into the holes 301 and 401after the front cover foil 300 and the antenna foil 400 are stackedwhile the positions of the first hole 301 and second hole 401 areadequately aligned. In this case, if the antenna foil 400 is stacked onthe front cover foil 300, the COB 200 may be inserted into the holes 301and 401 after the stacked foils 300 and 400 are turned over. Otherprocesses are substantially the same as those for embodying the methodof manufacturing the combi type IC card or the contact type IC card.

FIG. 3(A) is a perspective view shown to explain a method ofmanufacturing an IC card according to another embodiment of the presentinvention, and FIG. 3(B) is a cross-sectional view of the IC card shownin FIG. 3(A).

The method of manufacturing the IC card according to FIG. 3(A) and FIG.3(B) is a modified process of applying the hot melt sheet 700. In FIG.2, the bottom of the hot melt sheet 700 is not directly adhered to theCOB 200. However, in FIG. 3, after the front cover foil 300 and theantenna foil 400 are stacked on the COB 200, the bottom of the hot meltsheet 700 is adhered to the top of the COB 200 via the second hole 401of the antenna foil 400. In this case, the hot melt sheet 700 stillneeds the central hole 720 for exposing the molding element 220, butdoes not need the sheet hole 710 for exposing the antenna electrode 212.In other words, a worker can electrically connect the antenna connectionelement 411 and the antenna electrode 212 of the COB 200 with asufficient visual field, while stacking the antenna foil 400. Thus,after such electrical connection, the worker can adhere the hot meltsheet 700 to the antenna foil 400. Accordingly, it does not matter ifthe hot melt sheet 700 is greater than the second hole 401. An adhesivestrength with the core sheet 500 can be increased by using the hot meltsheet 700 having an area wider than that of the second hole 401. In casewhere the hot melt sheet 700 is adhered after the antenna foil 400 isstacked as above, it is preferable that the second hole 401 has a shapeshown in FIG. 4(B), which will be described later.

FIG. 4(A) and FIG. 4(B) are plane views each showing the second holeformed in the antenna sheet according to an embodiment of the presentinvention.

The second hole 401 is formed in the antenna foil 400 of the combi typeIC card according to the present invention. It is necessary that thesecond hole 401 be formed so that the connection element 411 of theantenna winding 410 and the antenna electrode 212 of the COB 200 areseen within the visual field of the worker, i.e., from the upperdirection. Accordingly, the second hole 401 includes a central portion402 having the size greater than the area of the molding element 220 ofthe COB 200 so that the molding element 220 can be exposed from theupper direction (for reference, the inner side of a closed curve is thehole and the outer side thereof is the antenna foil in FIG. 4(A)), asshown in FIG. 4(A).

Furthermore, outer protrusions 403 of an ear shape that are outwardlyprotruded are formed at both sides of the central portion 402 so thatthe antenna electrode 212 can be exposed from the upper direction. Theconnection element 411 of the antenna winding 410 is formed to traversethe outer protrusions 403. Therefore, the worker can electricallyconnect the antenna connection element 411 and the antenna electrode 212located below it through the outer protrusion 403 hole. For reference,one side of both sides of the antenna foil 400 in which the antennawinding 410 is formed is oriented downwardly. In other words, the sidein which the antenna winding 410 is formed becomes the side stacked onthe front cover foil 300. It is preferable that the center points of theouter protrusion 403, the hot melt sheet hole 710 and the antennaelectrode 212 are coincident with one another on the plane.

If the hot melt sheet 700 is applied after the antenna foil 400 isstacked, it is preferred that the second hole 401 formed in the antennafoil 400 has a shape as shown in FIG. 4(B) (for reference, the innerside of a closed curve is the hole and an outer side thereof is theantenna foil in FIG. 4(B)). At this time, the central hole 402 havingthe size greater than the area of the molding element 220 of the COB 200is formed in the second hole 401 so that the molding element 220 can beseen from the upper direction, i.e., by the worker's visual field.Further, a pair of inner protrusions 404 are protruded toward the insideof both sides of the central hole 402, and the up and down directions ofboth sides of the central hole 402 with them spaced apart by somedistance, respectively. In other words, the four inner protrusions 404are a portion of the antenna foil 400. In the connection element 411 ofthe antenna winding 410, the distance between the pair of the innerprotrusions 404 serves as a lateral hole 405 formed at the edge of thecentral hole 402.

Further, the connection element 411 of the antenna winding 410 is formedto traverse the lateral hole 405. In other words, after stacking theantenna foil 400 in which only the pair of the lateral holes 405 areformed, the worker can electrically connect the antenna connectionelement 411 and the antenna electrode 212 of the COB 200 through thelateral holes 405 and then form the second hole 401 of a shape as shownin FIG. 4(B) in the antenna foil 400 by using a puncher, etc. Next, thehot melt sheet 700 is adhered on the second hole 401, wherein themolding element 220 is outwardly exposed and the hot melt sheet 700having the size greater than the second hole 401 is employed.

FIG. 5(A) is a traverse section view (taken along lines A-A′ in FIG.2(A)) of the IC card on which a plurality of foils are stacked in afirst step half-finished product manufacturing process according to anembodiment of the present invention, and FIG. 5(B) is a longitudinalsection view (taken along lines B-B′ in FIG. 2(A)) of the IC card shownin FIG. 5(A). In this embodiment, the method of manufacturing the ICcard is composed of a first step half-finished product manufacturingprocess and a second step finished product manufacturing process. Thefirst step process includes a process of manufacturing a basic IC card(i.e., the step of inserting the antenna foil and the core foil into theCOB and then stacking them), and the second step process includes aprocess of stacking the printing foils, the coating foil and the like.

In the method of manufacturing the IC card according to the presentinvention, the first step process being the half-finished productmanufacturing process includes stacking a plurality of foils. A firstwork plate (not shown), which is generally flat and has a hole formed atits given place that has substantially the same shape and area as themain board 210 of the COB 200, is first laid on the floor (it ispreferred that the first work plate has substantially the same thicknessas the main board). The COB 200 whose electrode surface 211 is inserteddownwardly is then located in the hole. It is preferable that the workplate is a metal plate of a predetermined thickness. This metal platehas an advantage that it can be easily compressed by heat as it isdescribed later on. At this time, after a plurality of foils for thehalf-finished product to be described later are stacked, the COB 200 maybe inserted into the work plate and then compressed without the need forthe process of inserting the COB 200 into the work plate having the holeformed therein.

The bottom of the hot melt two-sided sheet 700 is adhered to portionsexcept for the molding element 220 and the antenna electrode 212 of theCOB 200, and the top of the hot melt two-sided sheet 700 is adhered tothe antenna foil 400 to be described later on. As an oilpaper ispreferably formed on the top of the hot melt two-sided sheet 700, thebottom of the hot melt two-sided sheet 700 is adhered to the top of theCOB 200 (adhesion by heat) and the oilpaper is then removed.

Therefore, the top of the hot melt two-sided sheet 700 can be adhered(adhered by heat) to the antenna foil 400. It is preferable that the hotmelt sheet 700 does not protrude outwardly beyond the outermost edgeportion of the COB 200, i.e., the main board 210 portion. It is morepreferable that the portion adhered to the core foil 500 becomes widenby maximum by allowing the outermost edge of the hot melt sheet 700 tobe substantially coincident with the outermost edge of the main board210.

Furthermore, a sheet hole 710 is formed or the

shape groove is formed in the portion where the hot melt sheet 700 makescontact with the antenna electrode 212. Thus, the antenna connectionelement 411 to be described later and the antenna electrode 212 can beelectrically connected through ultrasonic welding, adhesion using aconductive adhesive, soldering and the like. Further, a central hole 720of substantially the same size as the area of the molding element 220 isformed in the central portion of the hot melt sheet 700. The moldingelement 220 of the COB 200 can be thus inserted into the central hole720.

In the COB 200 having the hot melt sheet 700 adhered on its top, theantenna foil 400 in which the second hole 401 is formed at itspredetermined location and the antenna winding 410 is formed at its oneside, is laid on the work plate so that the molding element 220 and theantenna electrode 212 of the COB 200 is exposed when viewed from theupper direction. In the above, the molding element 220 is inserted intothe second hole 401. It may be preferred that the bottom of the antennafoil 400 keeps parallel with the bottom of the main board. As describedlater, however, it is possible to lay the other at least one foil (forexample, a second overlay foil, etc.) before the antenna foil 400 islaid and then to stack the antenna foil 400 on the other at least onefoil.

Furthermore, the step of applying the hot melt sheet 700 may be changed.In this case, the bottom of the hot melt sheet 700 is not directlyadhered to the COB 200, but may be adhered to the top of the COB 200through the second hole 401 of the antenna foil 400 after the secondoverlay foil 10 and the antenna foil 400 are stacked on the COB 200. Inthis case, the hot melt sheet 700 still needs the central hole 720 (seeFIG. 2(A)) for exposing the molding element 220, but does not need thesheet hole 710 for exposing the antenna electrode 212. In other words, aworker can electrically connect the antenna connection element 411 andthe antenna electrode 212 of the COB 200 with a sufficient visual field,while stacking the antenna foil 400. Thus, after such electricalconnection, the worker can adhere the hot melt sheet 700 to the antennafoil 400. Accordingly, it does not matter if the hot melt sheet 700 isgreater than the second hole 401. An adhesive strength with the coresheet 500 can be increased by using the hot melt sheet 700 having anarea wider than that of the second hole 401. In case where the hot meltsheet 700 is adhered after the antenna foil 400 is stacked as such, itis preferable that the second hole 401 has a shape shown in FIG. 4(B).

In the above, the second hole 401 may have a variety shapes. The moldingelement 220 and the antenna electrode 212 may be exposed upwardly.Furthermore, it is required that both ends (the antenna connectionelement 411) of the antenna winding 410 be adequately protruded towardthe inside of the second hole. The antenna connection element 411 has tobe formed at a location corresponding to the antenna electrode 212.Since technology for forming such an antenna connection element 411 isknown to those skilled in the art; detailed description on it will beomitted. In addition, the antenna foil 400 may be stacked after theantenna 410 is formed, or the antenna 410 may be formed after a foilhaving the antenna 401 not formed therein is stacked.

It is preferred that the antenna foil 400 is stacked after the secondoverlay foil 10 having a hole (hereinafter, referred to as “fifth hole”11) of substantially the same area and shape as the main board 210 ofthe COB 200 is inserted into the molding element 220 of the COB 200,before the antenna foil 400 is stacked. In this case, given portions ofthe second overlay foil 10 and the antenna foil 400 are spot-adheredusing ultrasonic waves, i.e., several points of them are tack-welded. Bystacking the second overlay foil 10, it is possible to prevent theantenna winding 410 from being faintly seen from the outside in thefinished IC card. Also, a difference in a thickness that is caused bythe hot melt sheet 700 can be thus solved. By making the thickness ofthe antenna foil 400 sufficiently thick, i.e., by making the thicknessof the antenna foil 400 substantially same as that of the moldingelement 220 of the COB 200, it is possible to make the thickness of themolding element 220 consisting of only the thickness of the secondoverlay foil 10 and the antenna foil 400. It is, however, preferablethat the thickness of the antenna foil 400 is smaller than that of themolding element 220 and the step of stacking the core foil 500 isfurther included.

If the antenna connection element 411 of the antenna foil 400 and theantenna electrode 212 of the COB 200 are electrically connected, atleast one core foil 500 having a third hole 501 of substantially thesame shape and area as the molding element 220 is stacked. The thirdhole 501 is inserted into the molding element 220 of the COB 200. Morepreferably, before the core foil 500 is stacked (or while the pluralityof the core foils are stacked, i.e., after one of two core foils isstacked), another hot melt sheet (not shown) enough to completely coverthe molding element 220 of the COB 200 is adhered. This makes itpossible to prevent a gap from generating between the molding element220 and the antenna foil 400 or the core foil 500 in subsequent thermalcompression. In particular, when a hot melt sheet is adhered between theantenna foil 400 and the core foil 500, the hot melt sheet is adapted tocover up to the second hole 401. This causes the hot melt sheet to melt,which fills the space around the antenna connection element 411 in thesecond hole 401 in subsequent thermal compression.

If the core foil 500 is stacked, a first overlay foil 20 having any holenot formed therein is stacked. It is preferred that the first and secondoverlay foils 20 and 10 are relatively thinner in thickness than theantenna foil 400 and the core foil 500. It is more preferable that theheight of the top of the core foil 500 is higher a little than theheight of the molding element 220 of the COB 200 after the at least onecore foil 500 is stacked. Furthermore, the upper portion of the moldingelement 220 corresponding to the difference between the heights of thecore foil 500 and the molding element 220 is filled with a filler 800′.This makes the thickness of the foils thinner than the molding element220 in subsequent thermal compression.

In other words, during the thermal compression, the thickness of thefoils is reduced, while the thickness of the molding element 220 keepssame as before. It thus prevents the thickness of the foil layer frombecoming thinner than that of the molding element 220 of the COB 200.The filler 800′ may include an ultraviolet filler that is hardened byultraviolet rays, an instant adhesive, an adhesive of an epoxy seriesthat is hardened by heat, and so on. At this time, in case of theultraviolet filler, it is hardened by ultraviolet rays after atransparent plate is placed on a portion to which the filler 800′ issupplied. In case of the adhesive of an epoxy series, it is hardened byan additional heating means.

If the first overlay foil 20 is stacked, a second work plate that issubstantially flat is laid on the first overlay foil 20 (when the firstwork plate is not initially laid, after the main board 210 of the COB200 is inserted into the hole the first work plate). At least one workplate is then compressed while applying heat.

In the method of manufacturing the IC card according to the presentinvention, the second step process for manufacturing the IC cardfinished product is as follows.

With respect to the IC card half-finished product formed through theabove-mentioned first step process, at least one foil having a hole (notshown) of substantially the same area as the main board of the COB isstacked below the second overlay foil 10. In the above, the thickness ofthe at least one foil must be not smaller than that of the main board ofthe COB (this is because the thickness of the foil portion may bereduced due to thermal compression). At this time, the at least one foilmay be a printing foil, if necessary, or a coating foil for preventingabrasion. This corresponds to the front cover foil 300 shown in FIG.2(A). Preferably, the step of stacking the other at least one foil(corresponding to the backside cover foil 600 in FIG. 2(A)) that will becoated on the first overlay foil 20, may be further included. Finally,the entire stacked foils are compressed while applying heat. The methodof manufacturing the IC card according to the present invention providesa method of manufacturing an IC card having a high smoothness by meansof twice thermal compressions; thermal compression in the half-finishedproduct manufacturing process and thermal compression in the finishedproduct manufacturing process.

FIG. 6(A) is a traverse section view of an IC card on which a pluralityof foils are stacked in a first step half-finished product manufacturingprocess according to another embodiment of the present invention, andFIG. 6(B) is a longitudinal section view of the IC card shown in FIG.6(A).

In the method of manufacturing the IC card according to the presentinvention, the first step process being the half-finished productmanufacturing process also basically includes stacking a plurality offoils around a COB. However, before the plurality of the foils arestacked, the step of thermally compressing the antenna foil 400 and alamination foil 400′ to form a base foil 400″ is first performed. Theantenna foil 400 and the lamination foil 400′ are first thermallyexpanded by thermally compressing them. A fourth hole 401″ into whichthe molding element 220 of the COB 200 is inserted, i.e., through whichthe molding element 220 is exposed upwardly, is then formed. It ispreferred that the antenna hole 402 for exposing the antenna connectionelement 411 corresponding to both ends of the antenna winding 410 isformed in the antenna foil 400 and the lamination foil 400′, before theantenna foil 400 and the lamination foil 400′ are thermally compressed.

A worker can electrically connect the antenna connection element 411 andthe antenna electrode 212 of the COB 200 through the antenna hole 402,by using soldering, ultrasonic welding, a conductive paste and the like.At this time, the antenna holes 402 have to be formed in twocorresponding to a point where the antenna electrode 212 of the COB 200will be located. Those skilled in the art will appreciate that this canbe easily implemented. After the antenna hole 402 is formed in each ofthe antenna foil 400 and the lamination foil 400′, the antenna winding410 of a predetermined shape is adequately wound on one side of theantenna foil 400. At this time, it is required that the antenna winding410 traverses the antenna hole 402 and both ends of the antenna winding410 traverse the antenna hole 402.

If the antenna winding 410 is formed, the lamination foil 400′ isthermally compressed onto the antenna foil 400. It is preferred that thelamination foil 400′ and the antenna foil 400 are thermally compressedso that the lamination foil 400′ can cover the side in which the antennawinding 410 of the antenna foil 400 is formed. The two foil layersformed by such thermal compression become the base foil 400″.

A fourth hole 401″ into which the molding element 220 of the COB 200 isinserted, is formed in the base foil 400″ that is formed by thermallycompressing the antenna foil 400 and the lamination foil 400′. In thiscase, the fourth hole 401″ must have an area through the molding element220 of the COB 200 can be completely exposed when viewed from the upperdirection. It is preferred that the fourth hole 401″ has substantiallythe same shape and area as the molding element 220. This process offorming the fourth hole 401″ may be performed by means of an automationprocess using a predetermined punching machine.

The process of forming the base foil 400″ according to an embodiment ofthe present invention includes forming the antenna hole 402 and thesecond hole 401 in the antenna foil 400 and the lamination foil 400′,respectively, winding the antenna winding 410 around the antenna foil400, and then thermally compressing the antenna foil 400 and thelamination foil 400′. At this time, the antenna hole 402 and the secondhole 401 have the same shape as that described above, and are suitablefor a case where the degree that the foil is expanded is small oruniform even if the antenna hole 402 and the second hole 401 arethermally compressed.

The base foil 400″ in which the fourth hole 401″ is formed is insertedinto the molding element 220 of the COB 200 through the fourth hole401″. The antenna connection element 411 that traverses the base foil400″ and the molding element 220 via the antenna hole 402, and theantenna electrode of the COB 200 are then electrically connected. Aworker can secure a visual field through the antenna hole 402 andaccordingly can obtain a strong physical connection such as soldering,ultrasonic welding and the like. At this time, a conductive paste may beused, if necessary, and all the methods for electrical connection may beused unless specially described.

Preferably, before the base foil 400″ is inserted into the moldingelement 220 of the COB 200, the hot melt two-sided sheet 700, i.e., thebottom of a sheet where an adhesive material melt by heat is formed atits both sides is adhered (adhered by applying heat using additionaldevice (device having a heater and a pressing plate)) to portions exceptfor the molding element 220 and the antenna electrode 212 of the COB200. Hereinafter (that is, during thermal compression in the second stepfinished product manufacturing process), the top of the sheet is adheredto the base foil 400″, which will be described later. In this case, thetop of the hot melt sheet 700 and the base foil 400″ may be adhered inadvance using the additional device.

An oilpaper is preferably formed on the top of the hot melt two-sidedsheet 700. At this time, the bottom of the hot melt two-sided sheet 700is adhered (adhered by heat) to the top of the COB 200 and the oilpaperis then removed. Therefore, the top of the hot melt two-sided sheet 700can be adhered (adhered by heat) to the base foil 400″. It is preferablethat the hot melt sheet 700 does not protrude outwardly beyond theoutermost edge portion of the COB 200, i.e., the main board 210 portion.It is more preferable that the portion adhered to the core foil 500becomes wide by maximum by allowing the outermost edge of the hot meltsheet 700 to be substantially coincident with the outermost edge of themain board 210.

Furthermore, a sheet hole 710 is formed or a “

” shape groove is formed in the portion where the hot melt sheet 700makes contact with the antenna electrode 212. Thus, the antennaconnection element 411 and the antenna electrode 212 can be electricallyconnected through ultrasonic welding, adhesion using a conductiveadhesive, soldering and the like. Further, a central hole ofsubstantially the same size as the area of the molding element 220 isformed at the central portion of the hot melt sheet 700, whereby themolding element 220 can be inserted into the central hole. Or, a holesmaller than the area of the molding element 220 is formed at thecentral portion of the hot melt sheet 700, whereby a worker can stripoff the oilpaper on the hot melt sheet 700 through the hole.

It is preferable that the bottom of the base foil 400 keeps parallelwith the bottom of the main board. As described above, however, afterthe other at least one foil (for example, the second overlay foil 10shown, etc.) is laid before the base foil 400″ is laid, the base foil400″ may be stacked on the foil. At this time, it is possible to changethe step of applying the hot melt sheet 700. In this case, the bottom ofthe hot melt sheet 700 is not directly adhered to the COB 200 unlikeFIG. 2, but is adhered to the top of the COB 200 through the fourth hole401″ of the base foil 400″ after the second overlay foil 10 and theantenna foil 400″ are stacked on the COB 200.

In the above, the hot melt sheet 700 still requires a central hole 720for exposing the molding element 220, but does not require a sheet hole710 for exposing the antenna electrode 212. In other words, a worker canelectrically connect the antenna connection element 411 and the antennaelectrode 212 of the COB 200 with a sufficient visual field, whilestacking the base foil 400″. The worker can thus adhere the hot meltsheet 700 on it after such electrical connection.

Accordingly, it does not matter if the hot melt sheet 700 is greaterthan the second hole 401. As the hot melt sheet 700 of the area widerthan that of the second hole 401 is used, an adhesive strength with acore sheet 500 to be described later on can be increased.

If the antenna connection element 411 of the base foil 400″ and theantenna electrode 212 of the COB 200 are connected, a filler 800 issupplied to the second hole 401 formed in the base foil 400″ and thecentral hole 720 formed in the hot melt sheet 700. The IC card completedthrough the filler thus maintains a generally high smoothness. It ispreferred that the adhesive property between the foils is improved byapplying the filler 800 having the adhesive property. Such a filler 800may include an ultraviolet filler that is hardened by ultraviolet rays,an instant adhesive, an adhesive of an epoxy series that is hardened byheat, and so on. At this time, in case of the ultraviolet filler, it ishardened by ultraviolet rays after a transparent plate is placed on aportion to which the filler 800′ is supplied. In case of the adhesive ofan epoxy series, it is hardened by an additional heating means.

As described above, it is preferred that the base foil 400″ is stackedafter the second overlay foil 10 having the first hole 301 ofsubstantially the same area and shape as the main board 210 of the COB200 is inserted into the molding element 220 of the COB 200. At thistime, given portions of the second overlay foil 10 and the base foil400″ are spot-adhered, i.e., track-welded by means of ultrasonic waves.Stacking the second overlay foil 10 prevents the antenna winding 410from being faintly viewed from the outside in the completed IC card.Further, it can solve a difference in the thickness occurring due to thehot melt sheet 700, as shown in the drawings.

If the filler 800 is applied and hardened, at least one core foil 500(only one is shown in this drawing) having a third hole 501 ofsubstantially the same shape and area as the molding element 220 isstacked. The third hole 501 is inserted into the molding element 220 ofthe COB 200. More preferably, before the core foil 500 is stacked (orwhile the plurality of the core foils are stacked, after one of two corefoils is stacked), the other hot melt sheet (not shown) is adheredenough to completely cover the molding element 220 of the COB 200. Itprevents a gap from occurring between the molding element 220 and thebase foil 400″ or the core foil 500 in subsequent thermal compression.In particular, if a hot melt sheet is adhered between the base foil 400″and the core foil 500, the hot melt sheet can cover the fourth hole401″. Thereby, in subsequent thermal compression, the hot melt sheet ismelt to fill the space around the antenna connection element 411 in thefourth hole 401″.

The antenna foil 400 and the lamination foil 400′ may be formedsufficiently thick as much thickness as the core foil 500 withoutstacking such a core foil 500. In other words, assuming that a thicknessof the molding element 220 is about 0.42 mm, a thickness of the antennafoil 400 and a thickness of the lamination foil 400′ may be set to about0.11 mm and 0.11 mm (or may be different), respectively, and the corefoil 500 of 0.22 mm may be then stacked on it, or a thickness of theantenna foil 400 and a thickness of the lamination foil 400′ may be setto 0.22 mm and 0.22 mm and the core foil 500 may be omitted.

If the core foil 500 is stacked, the first overlay foil 20 having a holenot formed therein is stacked. It is preferable that the first andsecond overlay foils 20 and 10 are relatively thinner in thickness thanthe base foil 400″ and the core foil 500. After the at least one corefoil 500 is stacked, it is not required that the height of the top ofthe core foil 500 be necessarily the same as the height of the moldingelement 220.

In other words, in case where the filler 800′ is filled into the upperportion of the molding element 220 corresponding to a difference betweenthe heights of the core foil 500 and the molding element 220 and isthermally compressed later, the thickness of the foils is not madethinner than the molding element 220 since the height of the top of thecore foil 500 is slightly higher than the height of the molding element220 of the COB 200. In other words, once being thermally compressed, thethickness of the foils is reduced, while the thickness of the moldingelement 220 is same as before. It prevents the thickness of the foillayer from becoming thinner than that of the molding element 220 of theCOB 200.

Furthermore, referring to the expanded drawing (indicated by dottedlines in FIG. 6(A)) with respect to the filler 800′ applied between thecore foil 500 and the molding element 220, the edge of the moldingelement 220 does not have an exact rectangular edge shape but a smoothlycurved shape. Thus, the smoothness of the final IC card can be furtherimproved by filling the gap between the molding element 220 and the corefoil 500 with the filler 800′. The filler 800′ may be the same as thefiller 800. Of course, the top of the core foil 500 may be formed lowerthan the molding element 220 of the COB 200.

In the method for manufacturing the IC card, the second step process ofmanufacturing the IC card finished product is as follows.

In the IC card half-finished product that is formed by the first stepprocess, at least one foil (corresponding to the front cover foil 300 inFIG. 2(A)) having a hole (not shown) of substantially the same area asthe main board 210 of the COB 200 is stacked below the second overlayfoil 10. At this time, the area of the at least one foil is not smallerthan the thickness of the main board of the COB (this is because thethickness of the foil portion can be reduced due to thermalcompression). At this time, the at least one foil may include a printingfoil, if necessary, and a coating foil for preventing abrasion. It ispreferred that the step of stacking the other at least one foil(corresponding to the backside cover foil 600 in FIG. 2(A)) that will becoated on the first overlay foil 20 may be further included. Finally,the stacked entire foils are compressed while applying heat.

As described above, the present invention provides a method of solving aproblem that may happen as an antenna foil is contracted due to firstthermal compression, while manufacturing an IC card of a highersmoothness through twice thermal compressions; thermal compression in ahalf-finished product manufacturing process and thermal compression in afinished product manufacturing process.

While the present invention has been described with reference to theparticular illustrative embodiments, it is not to be restricted by theembodiments but only by the appended claims. It is to be appreciatedthat those skilled in the art can change or modify the embodimentswithout departing from the scope and spirit of the present invention.

1. A method for manufacturing an IC card by stacking at least two foilswith an electrode surface for a terminal of a COB exposed outwardly, themethod comprising steps of: providing a COB whose electrode surface fora terminal of the COB is oriented downwardly; stacking at least twofoils having a rectangular hole on the COB so that the COB is insertedthrough the rectangular hole; stacking a cover foil on the foils; andcompressing the stacked foils and the COB.
 2. The method as defined inclaim 1 wherein said COB further comprises a rectangular hot melt sheeton the edge of the COB.
 3. (canceled)
 4. A method for manufacturing anIC card by exposing an electrode surface for a contact terminal of a COBoutwardly, mounting an antenna for a non-contact terminal in the ICcard, and stacking at least two foils, the COB consisting of a moldingportion, an antenna electrode for the non-contact terminal, and anelectrode surface for the contact terminal, the method comprising stepsof: providing a COB whose electrode surface for a contact terminal ofthe COB is oriented downwardly; stacking on the COB a first foil havinga first hole so that the COB is inserted through the first hole;stacking on the first foil an antenna foil being equipped with anantenna and having a second hole so that the COB is inserted through thesecond hole; connecting electrically an antenna with the antennaelectrode of the COB; stacking on the antenna foil a core foil in whicha rectangular hole is formed so as to receive the molding portion of theCOB; stacking a cover foil on the core foil; and compressing the stackedfoils and the COB.
 5. The method as defined in claim 4 wherein said COBfurther comprises a rectangular hot melt sheet on the edge of the COB.6. The method as defined in claim 5 wherein said rectangular hot meltsheet is formed with a pair of holes so as to provide electrical contactbetween the antenna connection elements and the antenna electrodes. 7.The method as defined in claim 4, which, after said step of connecting,further comprises adhering a rectangular hot melt sheet to the edge ofthe COB.
 8. An IC card with an electrode surface for a terminal of a COBexposed outwardly, which comprises: a COB consisting of a main board, amolding portion and an electrode surface for a terminal on the bottomsurface of the main board; at least two foils having a rectangular holeon the COB so that the COB is inserted through the rectangular hole; anda cover foil stacked on the foils.
 9. The IC card as defined in claim 8in which said COB further comprises a rectangular hot melt sheet on theedge of the COB.
 10. The IC card as defined in claim 8, which furthercomprises under said cover foil a core foil in which a rectangular holeis formed so as to receive the molding portion of the COB.
 11. An ICcard exposing an electrode surface for a contact terminal of a COBoutwardly, mounted with an antenna for a non-contact terminal in the ICcard, and stacked with at least two foils, which comprises: a COBconsisting of a main board, a molding portion, a pair of antennaelectrodes for the non-contact terminal, and an electrode surface forthe contact terminal on the bottom surface of the main board; a firstfoil having a first hole so that the COB is inserted through the firsthole; an antenna foil stacked on the first foil, which is equipped withan antenna and has a second hole so that the COB is inserted through thesecond hole and which connects electrically an antenna with the antennaelectrode of the COB; a core foil stacked on the antenna foil, which isformed with a rectangular hole so as to receive the molding portion ofthe COB; and a cover foil stacked on the core foil.
 12. The IC card asdefined in claim 11 in which said COB further comprises a rectangularhot melt sheet on the edge of the COB.
 13. The IC card as defined inclaim 12 in which said rectangular hot melt sheet is formed with a pairof holes so as to provide electrical contact between the antennaconnection elements and the antenna electrodes.
 14. The IC card asdefined in claim 11 in which said COB further comprises a rectangularhot melt sheet on the antenna foil along the edge of the COB.
 15. Amethod for manufacturing a half-finished product of an IC card byexposing an electrode surface for a contact terminal of a COB outwardly,mounting an antenna for a non-contact terminal in the IC card, andstacking at least two foils, the COB consisting of a molding portion, anantenna electrode for the non-contact terminal, and an electrode surfacefor the contact terminal, the method comprising steps of: providing aCOB whose electrode surface for a contact terminal of the COB isoriented downwardly; stacking on the COB a first foil having a firsthole so that the COB is inserted through the first hole; stacking on thefirst foil an antenna foil being equipped with an antenna and having asecond hole so that the COB is inserted through the second hole;connecting electrically an antenna with the antenna electrode of theCOB; stacking on the antenna foil a core foil in which a rectangularhole is formed so as to receive the molding portion of the COB; stackingan overlay foil on the core foil; and compressing the stacked foils andthe COB.
 16. The method as defined in claim 15 wherein said COB furthercomprises a rectangular hot melt sheet on the edge of the COB.
 17. Themethod as defined in claim 16 wherein said rectangular hot melt sheet isformed with a pair of holes so as to provide electrical contact betweenthe antenna connection elements and the antenna electrodes.
 18. Themethod as defined in claim 15, which, after said step of connecting,further comprises adhering a rectangular hot melt sheet to the edge ofthe COB.
 19. A half-finished product of an IC card by exposing anelectrode surface for a contact terminal of a COB outwardly, mountedwith an antenna for a non-contact terminal in the IC card, and stackedwith at least two foils, which comprises: a COB consisting of a mainboard, a molding portion, a pair of antenna electrodes for thenon-contact terminal, and an electrode surface for the contact terminalon the bottom surface of the main board; a first foil having a firsthole so that the COB is inserted through the first hole; an antenna foilstacked on the first foil, which is equipped with an antenna and has asecond hole so that the COB is inserted through the second hole andwhich connects electrically an antenna with the antenna electrode of theCOB; a core foil stacked on the antenna foil, which is formed with arectangular hole so as to receive the molding portion of the COB; and anoverlay foil stacked on the core foil.
 20. The half-finished product ofan IC card as defined in claim 19 in which said COB further comprises arectangular hot melt sheet on the edge of the COB.
 21. The half-finishedproduct of an IC card as defined in claim 20 in which said rectangularhot melt sheet is formed with a pair of holes so as to provideelectrical contact between the antenna connection elements and theantenna electrodes.
 22. The half-finished product of an IC card asdefined in claim 19 in which said COB further comprises a rectangularhot melt sheet on the antenna foil along the edge of the COB. 23-34.(canceled)